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Joined 7 months ago
Cake day: April 9th, 2026
  • nousername@lemmus.orgtoTechnology@lemmy.world•CXMT completes engineering sample validation for sixth-generation DRAM technology platform based on 4F² architectureEnglish
    71·
    3 days ago

    lol. That whole thing was propaganda. First of all, the 4F2 process isn’t better than the 6F2 process. 4F2 is worse! 4F2, just means they’re being forced to build the chip vertically in more steps because they don’t have access to ASMLs most advanced lithography machines. Because they can’t pack more transistors into a smaller space by making them smaller, they’re being forced to build them vertically, which requires more layers. And more layers means more chances for microscopic mistakes. And that’s the case! Their yields are abysmal, only 30% yields, while Samsung and SK Hynix typically get 70% yields. And what do 30% yields mean? It’s means the process isn’t commercially viable. The only reason it even exists is because the Chinese government forces it to. In order to be commercially viable, their prices would have to be much higher than everyone else’s, in which case it’s a huge waste of time. Granted, the Chinese government might flood the world with these chips as a loss leader, but mostly they’re just making them to satisfy the Chinese government’s own need for chips. They probably won’t leave the country in any significant number.